• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a holding device (100), in particular a chuck, for a substrate (101), with a base body (103) with an upper side (105), a carrier element (107), the carrier element (107) in a recess (109) of the base body (103) is arranged such that it can be moved vertically such that it can be adjusted between a protruding loading position and a retracted clamping position, and wherein the carrier element (107) comprises a contact surface (111) for placing the substrate (101), the contact surface (111 ) has a smaller diameter than the base body (103), and a lifting element which lifts the carrier element (107) into the loading position, the carrier element (107) sealing the recess (109) so that between the base body (103) and the Support element (107) there is a sealed cavity (113) which can be subjected to a negative pressure which counteracts the action of the lifting element, and wherein spacers (117a, 1 17b) are provided, which define the clamping position of the carrier element (107), in which the support surface (111) of the carrier element (107) is arranged essentially flush with the top side (105) of the base body (103).
    公开号:AT521280A2
    申请号:T50420/2019
    申请日:2019-05-10
    公开日:2019-12-15
    发明作者:
    申请人:Suss Microtec Lithography Gmbh；
    IPC主号:
    专利说明:

    SUMMARY
    The invention relates to a holding device (100), in particular a chuck, for a substrate (101), with a base body (103) with an upper side (105), a carrier element (107), the carrier element (107) in a recess (109) of the base body (103) is arranged such that it can be moved vertically such that it can be adjusted between a projecting loading position and a retracted clamping position, and wherein the carrier element (107) comprises a support surface (111) for placing the substrate (101), the support surface (111 ) has a smaller diameter than the base body (103), and a lifting element which lifts the carrier element (107) into the loading position, the carrier element (107) sealing the recess (109) so that between the base body (103) and the Support element (107) there is a sealed cavity (113) which can be subjected to a negative pressure which counteracts the action of the lifting element, and wherein spacers (117a, 1 17b) are provided, which define the clamping position of the support element (107), in which the support surface (111) of the support element (107) is arranged essentially flush with the upper side (105) of the base body (103).
    Fig. 1/28
    The present invention relates to the field of holding and fixing substrates, in particular in production plants for microstructure components.
    Substrates such as semiconductor wafers are processed in special production systems for microstructure components, for example in coating systems (coaters). Special substrate holders, so-called chucks, are often used to hold the substrates in these systems. Often these are spinner chucks that rotate the substrates at high speed, for example to coat the substrates evenly. The substrates are fixed on the chuck, for example by means of vacuum suction.
    The substrates processed in this way are mostly flat and flat disks. However, they can also deviate from an ideally flat shape and have a so-called “bow”. Bent wafers are called warped wafers, for example. It is difficult to fix curved substrates to spinner chucks using vacuum suction, because due to the bending no or only an insufficient vacuum can be built up between the top of the chuck and the underside of the substrate.
    In order to improve the fixation of bent substrates, it is known to arrange soft sealing lips on the contact surface of the chuck. The substrate lies on the circumference of the sealing lip, so that a vacuum is built up between the substrate and the chuck.
    However, this has the disadvantage that the substrate is not guided horizontally during the suction process. When the air is evacuated, the substrate can slip or blur sideways within the holding surface and the resulting vertical movement until it finally lies flat on the chuck. As a result, the centering of the substrate to the chuck deteriorates, which in the later process leads to undesirable effects such as vibrations or an inhomogeneous, i.e. can lead along the circumference of the edge bead removal (EBR).
    Contamination and aging of the sealing lips create further disadvantages. The sealing lips can generate particles and change their surface and friction properties over time. This can lead to increased / 28
    - 2 Carry out maintenance, for example by replacing the sealing lips, correcting the storage position or cleaning the sealing lips.
    It is therefore the object of the present invention to hold and fix a substrate, in particular a bent substrate, efficiently and safely.
    This object is solved by the features of the independent claims. Advantageous forms of further training are the subject of the dependent claims, the description and the drawings.
    According to a first aspect, the invention relates to a holding device, in particular a chuck, for a substrate, with a base body with an upper side, a support element, the support element being arranged in a recess in the base body so that it can move vertically between a protruding loading position and a retracted position Clamping position is adjustable, and wherein the support element comprises a support surface for placing the substrate, the support surface having a smaller diameter than the base body, and a lifting element which lifts the support element into the loading position, the support element sealing the recess so that between the Base body and the support element is a sealed cavity, which can be acted upon by a vacuum that counteracts the action of the lifting element. This has the advantage that substrates which are difficult to suck, in particular warped wafers, can be held securely due to the initially small vacuum area and can be guided in the vertical movement.
    Due to the small size of the support surface of the carrier element, sufficient sealing can be achieved in the loading position in order to first fix a bent wafer on the carrier element. The substrate can then be pulled against the top of the base body in the clamping position and finally clamped.
    The top of the base body can correspond to a clamping surface for the substrate, on which the substrate is clamped in the clamping position.
    / 28
    - 3 Vertical movement here means a movement coaxial to a transverse axis of the base body. In particular, a movement perpendicular to the support surface of the carrier element is meant.
    The diameter of the carrier element is, for example, less than half, a third or a quarter of the diameter of the substrate and / or the diameter of the base body. In the case of strongly bent substrates in particular, the smallest possible diameter of the carrier element is advantageous in order to produce sufficient vacuum suction in the loading position.
    The carrier element can be movably arranged in the recess in the manner of a piston.
    The recess can be a depression in the base body, in particular along a central axis of the base body. The recess can have a round diameter. The diameter of the recess can correspond to the diameter of the carrier element or can be minimally larger.
    The cavity can be the space that leads between the bottom of the recess and the carrier element. The size of the cavity can be defined by the position of the carrier element and vary with the movement of the carrier element.
    The substrate can be a wafer. The substrate can be disc-shaped. The substrate can have a largely round circumference with a diameter of 2, 3, 4, 5, 6, 8, 12 or 18 inches. The substrate can also be largely flat and can have a thickness between 50 and 4000 μm. The substrate can have a straight edge (flat) and / or at least one notch (notch). The substrate can also be angular, in particular square or rectangular.
    The substrate can be formed from a semiconductor material, for example silicon (Si) or gallium arsenide (GaAs), a glass, for example quartz glass, a plastic or a ceramic. The substrate can be formed from a monocrystalline, a polycrystalline or an amorphous material. The substrate may further comprise a variety of bonded materials.
    / 28
    - 4 The substrate can comprise electrical circuits, for example transistors, light-emitting diodes or photodetectors, electrical conductor tracks which connect these circuits, or optical components and MEMS or MOEMS structures. The substrate can also have coatings, for example structured chrome layers, pre-crosslinked or hardened bond adhesives or separating layers.
    According to one embodiment, spacers are provided which define the clamping position of the support element, in which the support surface of the support element is arranged essentially flush with the top of the base body. This achieves the advantage that the position of the carrier element in the clamping position can be determined in such a way that the support surface and the top of the base body form a common support for the substrate, on which the substrate can be clamped in the clamping position.
    A difference in height between the support surface of the carrier element and the upper side of the base body after the lowering is preferably less than a height fluctuation in the substrate due to a deformation or bending. The height deviation is particularly preferably less than a substrate thickness.
    According to one embodiment, the base body comprises a sealing means, in particular a sealing lip, which surrounds the carrier element at a distance and can seal between the top of the base body and the substrate. This has the advantage that the substrate can be sucked and clamped particularly efficiently in the clamping position. With the help of the sealant, a vacuum can be created under the substrate, which exerts a uniform force on the substrate and clamps it on.
    According to one embodiment, the carrier element is provided with a seal which seals on the side wall of the recess in the base body. This has the advantage that the tightness of the cavity and the smooth movement of the carrier element in the recess can be ensured.
    / 28
    According to one embodiment, the carrier element comprises fixing means for fixing the substrate resting on the support surface, in particular suction openings. This has the advantage that the substrate can be securely fixed on the support surface.
    According to one embodiment, the base body has further fixing means for fixing the lowered substrate on the upper side. The further fixing means can comprise further suction openings.
    According to one embodiment, the cavity and the fixing means are fluidly connected. This has the advantage that a particularly simple construction and control of the holding device is made possible. For example, a single pressure supply is sufficient to control the fixing of the substrate and the lowering of the carrier element.
    According to one embodiment, the holding device has a pressure connection, via which the pressure in the cavity can be controlled. This has the advantage that the functions of the carrier element can be controlled by means of pressurization, for example via an external pressure supply.
    According to one embodiment, the lifting element comprises a tensioning element, in particular a compression spring, which is designed to exert a force on the carrier element in order to raise the latter.
    The lifting element generates a force on the carrier element which counteracts the attractive force generated by the negative pressure in the cavity. The lifting element, in particular the tensioning element, can be arranged between the base body and the carrier element, in particular in the recess in the base body.
    The holding device can further comprise a stop, the lifting element being designed to press the carrier element against the stop. The stop defines, for example, the loading position of the carrier element and prevents the carrier element from sliding out of the recess.
    / 28
    According to one embodiment, the holding device comprises a rotating device for rotating the holding device, in particular the base body and the carrier element. This has the advantage that a substrate held particularly securely by the holding device can be rotated for further processing steps, such as the application of coatings.
    According to a second aspect, the invention relates to a production system for microstructure components, which comprises a holding device according to one of the preceding claims. This has the advantage that substrates which are difficult to suck, in particular warped wafers, can be held and processed efficiently and safely in the production system.
    The production system can be a coater, a coater, a developer, a SpinDryer, a mask aligner, a projection scanner, a laser stepper, a wafer bonder, a photo mask system, a cleaning system or an imprint system.
    According to a third aspect, the invention relates to a method for holding a substrate in a holding device with a base body and a carrier element, the method comprising the following method steps: lifting the carrier element into a loading position, the carrier element having a smaller diameter than the substrate, placing it on of the substrate on a support surface of the support element, fixing the substrate on the support surface, and lowering the support element into a clamping position in which the support surface of the support element is arranged essentially flush with an upper side of the base body. This has the advantage that substrates which are difficult to suck, in particular warped wafers, can be held securely due to the initially small vacuum area and can be guided in the vertical movement.
    The diameter of the carrier element is, for example, less than half, a third or a quarter of the diameter of the substrate and / or the diameter of the base body. In the case of strongly bent substrates in particular, the smallest possible diameter of the carrier element is advantageous in order to produce sufficient vacuum suction in the loading position.
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    - 7 The small diameter compared to the wafer size leads to an initially smaller and easier to seal vacuum area for suctioning the wafer in the loading position. In the case of a bent wafer in particular, the suction is simplified by the smaller vacuum area. Then we pull the substrate against the top of the base body, where it can be finally clamped over the entire surface in the clamping position.
    According to one embodiment, a first negative pressure is applied to a cavity of the holding device to fix the substrate on the support surface, and a second negative pressure is applied to the cavity to lower the carrier element into the clamping position, the second negative pressure being a lower pressure than the first negative pressure , This has the advantage that the control of the holding device, in particular the fixing of the substrate and the movement of the carrier element, can take place via a single pressure connection. By changing the negative pressure, the substrate can first be pre-fixed, then the support element adjusted and then the substrate finally fixed
    According to one embodiment, placing the substrate on the support surface of the support element brings about a reduction in pressure in the cavity, in particular by sealing suction openings on the support surface, the lowering of the support element into the clamping position being triggered and / or supported by the reduction in pressure. This has the advantage that a particularly simple control of the holding device is made possible, since in particular no manual pressure change is required to lower the carrier element.
    For example, to fix the substrate on the support surface, the first negative pressure is first applied to the cavity of the holding device, and then the second negative pressure is established in the cavity after the substrate is placed on the carrier element, for example due to the covering of suction openings on the support surface the substrate.
    According to one embodiment, the carrier element presses the substrate in the clamping position against the upper side of the base body, a force exerted on the substrate being so great that any bending of the substrate is reduced. This has the advantage that the bent / 28
    - 8 substrates can be pulled smooth from the holding device. This allows further processing of the substrate, e.g. applying a coating, simplified or made possible. Furthermore, a smoothly drawn substrate can be kept more stable, especially when the chuck is rotating.
    The bent substrate can be a so-called “warped wafer”. The bending can occur due to a small thickness of the substrate and / or due to internal stresses in the substrate.
    According to one embodiment, the substrate is attracted to the upper side in the clamping position by a negative pressure acting between the substrate and the upper side of the base body. This gives the advantage that the substrate can be fixed securely and firmly on the top in the clamping position.
    According to one embodiment, the method further comprises rotating the substrate, in particular after the carrier element has been lowered. This has the advantage that the substrate, which is held particularly securely in this way, can be rotated for further processing steps.
    Further exemplary embodiments are explained in more detail with reference to the accompanying drawings. Show it:
    Fig. 1 a schematic representation of a Holding device for one substrate; 2a-d schematic representations one Holding device at Placing a substrate; Fig. 3 is a schematic representation one manufacturing plant For
    Microstructure components with a holding device; and
    4 shows a flow diagram of a method for holding a substrate in a holding device.
    1 shows a schematic illustration of a holding device 100 for a substrate 101 according to one embodiment.
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    9 The holding device 100 comprises a base body 103 with an upper side 105, a carrier element 107, which is arranged in a recess 109 in the base body 103 so that it can be moved vertically such that it can be adjusted between a protruding loading position and a retracted clamping position, the carrier element 107 being one Support surface 111 for placing the substrate 101 comprises, wherein the support surface 111 has a smaller diameter than the base body 103. The holding device 100 further comprises a lifting element which lifts the carrier element 107 into the loading position.
    The carrier element 107 seals the recess 109 in such a way that there is a sealed cavity 113 between the base body 103 and the carrier element 107, which can be subjected to a negative pressure which counteracts the action of the lifting element.
    The upper side 105 of the base body 103 can correspond to a clamping surface for the substrate 101, on which the substrate 101 is clamped in the clamping position.
    The carrier element 107 can be adjustably accommodated in the recess 109 in the manner of a piston. By applying a vacuum to the sealed cavity, the carrier element 107 can be moved from the loading position into the clamping position.
    The cavity is the space that remains between the bottom of the recess 109 and the carrier element 101. The size of the cavity can thus be changed with the position of the carrier element 101 and depends on this.
    In an alternative embodiment, the cavity 113 can also be formed by further bores or fluid lines in the base body 103.
    In the embodiment shown, the lifting element is formed by two tensioning elements 115a, 115b in the form of compression springs, which are arranged in the cutout 109 of the base body 103 and exert a repulsive force on the carrier element.
    In the embodiment shown in FIG. 1, a sealant 119 is arranged on the surface of the base body. The sealant 119 can vacuum suction the substrate 101 on the support surface 111 and / or the / 28th
    - 10 Improve the top surface 105 of the base body 103 in the clamping position. In particular, a large-area vacuum can be built up between the substrate 101 and the holding device 100 by means of the sealant 119.
    The substrate 101 may be a wafer. The substrate 101 can be disk-shaped. The substrate 101 can have a largely round circumference with a diameter of 2, 3, 4, 5, 6, 8, 12 or 18 inches. The substrate 101 can also be largely flat and can have a thickness between 50 and 4000 μm. The substrate 101 can have a straight edge (flat) and / or at least one notch (notch). The substrate 101 can also be angular, in particular square or rectangular.
    The substrate 101 can be formed from a semiconductor material, for example silicon (Si) or gallium arsenide (GaAs), a glass, for example quartz glass, a plastic or a ceramic. The substrate can be formed from a monocrystalline, a polycrystalline or an amorphous material. Furthermore, substrate 101 may comprise a variety of bonded materials.
    The substrate 101 can comprise electrical circuits, for example transistors, light-emitting diodes or photodetectors, electrical conductor tracks which connect these circuits, or optical components and MEMS or MOEMS structures. The substrate 101 can furthermore have coatings, for example structured chrome layers, pre-crosslinked or hardened bond adhesives or separating layers.
    The holding device 100 further comprises a seal 125, which seals on the side wall of the recess 109 in the base body 103. The seal 125 can be an O-ring or a sealing lip.
    The carrier element 107 also has spacers 117a, 117b, for example in the form of pins, on its underside.
    With the spacers 117a, 117b, a sinking depth of the carrier element 107 into the recess 109 can be defined and it can be ensured that the contact surface 111 of the carrier element 107 in the clamping position is arranged substantially flush with the upper side 105 of the base body 103/28
    - 11 is. The spacers 117a, 117b can also prevent the carrier element 107 from completely sinking into the recess and thus ensure a minimum size of the cavity 113.
    In the embodiment shown in FIG. 1, the carrier element 107 also has fixing means 123a, 123b for fixing the substrate lying on the support surface. The fixing means 123a, 123b can be suction openings. Furthermore, the fixing means 123a, 123b can comprise vacuum drilling or vacuum grooves.
    The base body 103 comprises a fluid channel 121 for pressurizing the cavity 113.
    The fluid channel 121 can be a bore, in particular a central bore, in the base body 113, which opens into the recess 109 or the cavity 113 formed by the recess 109.
    According to one embodiment, the holding device 100 has a pressure connection, not shown in FIG. 1, via which the pressure in the cavity 113 can be controlled. The fluid channel 121 can fluidly connect the cavity 113 to the pressure connection. When the cavity 113 is acted upon by the negative pressure, it consequently also bears against the fixing means 123a, 123b, as a result of which they can suck in the substrate 101.
    The holding device 100 can further comprise a stop against which the carrier element 107 is pressed in the loading position. The position of the carrier element 107 in the loading position can thus be defined with the stop. At the same time, the stop can prevent the carrier element 107 from sliding out of the recess 109.
    Figs. 2a-d show schematic representations of the holding device 100 when placing a substrate 101 according to a further embodiment.
    The carrier element 107 of the holding device 100 in FIGS. 2a-d comprises four suction openings 201a, 201b, 201c, 201d. The suction openings 201a, 201b, 201c, 201d form the fixing means for fixing the substrate 101 on the support surface 111.
    / 28
    The suction openings 201a, 201b, 201c, 201d are connected to the cavity 113 via a fluid channel 203.
    The holding device 100 in FIGS. 2a-d may comprise a rotating device, not shown. In particular, the holding device 100 is a spinner chuck, in which vacuum is guided in a hollow shaft of the motor to the chuck 100 or to the cavity 103 in order on the one hand to suck in the substrate 101 and on the other hand to adjust the position of the carrier element 107.
    2a shows the holding device 100 in the loading position before the substrate 101 is placed on it.
    The vertically movable support element 107 is raised by the compression springs 115ab and pressed against a stop, not shown.
    The cavity 113 is subjected to a first negative pressure P1, as a result of which a low vacuum is created in the cavity 113. The resulting force is too low to compress the compression springs 115a-b, so that the carrier element 107 continues to bear against the stop and protrudes beyond the upper side 105 of the base body 103.
    Due to the factual connection of the suction openings 201a, 201b, 201c, 201d with the cavity 113, air can also be sucked into the cavity 113, which can additionally prevent the creation of an excessive vacuum in the cavity 113.
    2b shows the substrate 101 being placed on the support surface 111 of the carrier element 107.
    The substrate 101 is sucked through the suction openings 201a, 201b, 201c, 201d on the support surface 111 and fixed. At the same time, the substrate 101 covers the suction openings 201a, 201b, 201c, 201d.
    By covering the suction openings 201a, 201b, 201c, 201d, it is prevented, for example, that air from the surroundings penetrates into the cavity 113. This can bring about an additional pressure reduction in the cavity 113, in which consequently a second negative pressure P2 is established, with P2 <P1.
    / 28
    In an alternative embodiment, the second suppressor P2 can also be set manually after the substrate 101 has been placed on it, for example by means of a pressure connection on the chuck 100.
    2c shows a lowering of the carrier element 107 into the clamping position after the substrate 101 has been placed on.
    The lowering of the carrier element 107 takes place due to the reduction in pressure in the cavity 113. The attractive force on the carrier element 107 due to the negative pressure P2 in the cavity 113 outweighs the repulsive force which the tensioning elements 115a, 115b exert on the carrier element 107. As a result, the clamping elements 115a, 115b are compressed.
    The carrier element 107 is lowered into the recess 109 to such an extent that the support surface 111 is arranged approximately flush with the top 105 of the base body 103, and the substrate 101 rests on the top 105 in addition to the support surface 111. The maximum sinking depth of the carrier element 107 is determined via the spacers 117a, 117b.
    The support surface 111 and the top 105 form a common clamping surface for the substrate 101 in the clamping position. In the embodiment shown in FIGS and bearing surface 111 rests.
    Alternatively, the base body 103 can also have a larger diameter than the substrate or, as shown in FIG. 1, a smaller diameter than the substrate 101. The holding device 100 can thus also be used for particularly small or particularly large substrates 101.
    2d shows a treatment of the substrate 101 after the carrier element 107 has been lowered.
    During the treatment, the substrate 101 is rotated, for example by means of a rotating device, not shown, which rotates the base body 103 and the carrier element 107.
    / 28
    For this purpose, the base body 103 can be rotatably mounted in a rigid holding element of the holding device 100. In particular, the holding device 100 is designed as a spin chuck.
    In addition to those shown in Figs. 2a-d shown suction openings 201a, 201b, 201c, 201d, the base body 103 can have further fixing means for fixing or clamping the lowered substrate 101 on the upper side 105. The further fixing means can comprise further suction openings.
    2d shows an application device 205 with which a fluid can be applied to the rotating substrate. The fluid is, for example, a lacquer, in particular a photoresist, a coating liquid, a cleaning liquid or a solvent.
    In an alternative embodiment, the sealant 119 shown in Fig. 2a-d, e.g. a sealing lip. The substrate 101 then comes into direct contact with the upper side 105 of the base body 103 in the clamping position. This has the advantage that a maintenance effort is reduced, since there is no longer any need to regularly replace the sealing lips and no more cleaning of the sealing lips. Furthermore, possible blurring of the substrate 101 when it is placed on the sealing lips can be avoided.
    The movable carrier element 100 can also replace lift pins for transferring the substrate 101 to an end effector, as are used in known chucks. To deposit the substrate on the holding device 100 or to pick it up again from the holding device 100, the carrier element 107 can lift the substrate, so that no additional lift pins are required.
    In an alternative embodiment, the base body 103 comprises further application openings and / or nozzles for fluids, which are arranged, for example, on the upper side 105 of the base body.
    By means of these further application openings on the upper side 105, a fluid can be applied to a rear side of the substrate 101 if the holding device 100 is in the loading position as shown in FIG. 2b and the substrate 101 lies on the carrier element 107.
    / 28
    The fluid can be applied to a surface on the back of the substrate 101 that is not covered by the carrier element 107. This achieves the advantage that coating or cleaning or solvent treatment of the back of the substrate is made possible without the substrate 101 having to be lifted off the holding device 100 and turned over.
    3 shows a production system 300 for microstructure components with a holding device 100 according to one embodiment.
    The production system 300 can be a coater, a coater, a developer, a spin dryer, a mask aligner, a projection scanner, a laser stepper, a wafer bonder, a photo mask system, a cleaning system or an imprint system.
    The holding device 100 can correspond to the holding device 100 shown in FIGS. 1 and / or 2a-d. The holding device 100 can be connected to a pressure supply of the production system 300.
    FIG. 3 also shows a robot arm 301 with an end effector 303 on which a substrate 101 rests. The substrate 101 can be placed on the holding device 100 by means of this robot arm 301, the carrier element being raised when the substrate 101 is placed on.
    FIG. 4 shows a flowchart of a method 400 for holding the substrate 101 in the holding device 100 according to an embodiment.
    The substrate 101 can be a glass or semiconductor substrate. Furthermore, the substrate 101 can be a wafer or a mask. The substrate 101 may correspond to the substrate 101 shown in FIGS. 1, 2a-d and / or FIG. 3.
    The method 400 can be carried out with the holding device 100 from FIGS. 1 and / or 2a-d, and comprises lifting 401 of the carrier element 107 into the loading position, the carrier element 107 having a smaller diameter than the substrate 100, and placing it on 403 of the substrate 101 on the support surface 111 of the support element 107, fixing 405 of the substrate 101 on the support surface 111, and lowering 407 of the support element 107 into the clamping position.
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    16 In the clamping position, the support surface 111 of the carrier element 107 is arranged essentially flush with the upper side 105 of the base body 103.
    The substrate 101 can be bent or deformed or can be very flexible. The bent substrate 101 can be a so-called “warped wafer”.
    The smaller diameter of the carrier element 107 compared to the substrate 101 means that, in particular, bent substrates 101 can be sucked in more easily than with a large-area chuck, since the vacuum area under the substrate 101 has a smaller size.
    According to one embodiment, a first negative pressure is applied to the cavity 113 of the holding device 100 to fix 405 the substrate 101 on the support surface 111, and a second negative pressure is applied to the cavity 113 to lower the carrier element 107 into the clamping position, the second negative pressure being applied is less pressure than the first negative pressure.
    The application of the negative pressure to the cavity 113 causes an attractive force to arise, which counteracts a repulsive force of a lifting element. The lifting element is set such that the attractive force on the carrier element 107 exceeds the repulsive force of the lifting element when the second negative pressure is applied. As a result, the carrier element 107 is lowered.
    The negative pressure can be applied to a pressure connection of the holding device via an external pressure supply.
    In an alternative embodiment, in order to fix 405 the substrate on the support surface 111, the first negative pressure is applied to the cavity 113 of the holding device 100, and the second negative pressure is established in the cavity 113 after the substrate 101 is placed on the carrier element 107, for example due to covering suction openings 201 ad on the support surface 111 by the substrate 101.
    In the clamping position, the substrate 101 can additionally be attracted and / or fixed to the upper side 105 by a negative pressure acting between the substrate 101 and the upper side 105 of the base body 103.
    / 28
    According to one embodiment, the carrier element 107 can press a bent or deformed substrate 101 in the clamping position against an upper side 105 of the base body 103 in such a way that a force exerted on the substrate 101 is so great that the substrate is bent or deformed 101 is reduced.
    The substrate 101 can be pulled smooth and / or clamped by the force exerted in this way.
    The method 400 may further comprise rotating the substrate 101, in particular after the carrier element 107 has been lowered 407 into the clamping position.
    After the substrate 101 has been lowered, the substrate 101 can be processed or treated, for example by applying a coating to the rotating substrate.
    The lowering 407 of the substrate 101 can take place a predetermined time after the application 403 of the substrate 101 or immediately after the application of the substrate 101, for example depending on preset process parameters.
    In a production system 300, the functioning of the holding device 100 is controlled, for example, by a process module.
    When a warped wafer is transferred from a substrate handler (robot, axis with end effector, etc.) to the holding device 100, the process module signals, for example to a substrate handler, that the substrate has been received on the excavated “Z chuck” (carrier element 107), whereupon a holding vacuum is deactivated on the substrate handler. A transfer error from the substrate handler to the holding device 100 can thus be minimized.
    During the lowering of the carrier element 107 with the bent substrate 101, the latter is centered and guided. Lateral slipping or blurring is no longer possible. A sealing lip 119 in the outer region of the holding device 100, for example on the upper side 105 of the base body 105, can be in / 28 with the substrate 101 during the lowering
    18 come into contact, so that a large-area vacuum builds up under the substrate and the substrate 101 is pulled flat over the surface.
    / 28
    - 19 list of reference symbols
    100 holder 101 substratum 103 body 105 top 107 support element 109 recess 111 bearing surface 113 cavity 115a-b clamping element 117a-b spacer 119 sealant 121 fluid channel 123a-b fixer 125 poetry 201a-d suction 203 fluid channel 205 applicator 300 Manufacturing plant for microstructure components 301 robot arm 303 end effector 400 Process for holding a substrate 401 Lifting the support element 403 Laying on the substrate 405 Fix the substrate 407 Lowering the support element
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    权利要求:
    Claims (14)
    [1]
    1. Holding device (100), in particular chuck, for a substrate (101), with:
    a base body (103) with an upper side (105), a support element (107), the support element (107) being arranged in a recess (109) of the base body (103) so that it can move vertically between a protruding loading position and a retracted position Clamping position is adjustable, and wherein the support element (107) comprises a support surface (111) for placing the substrate (101), the support surface (111) having a smaller diameter than the base body (103), and a lifting element which supports the support element ( 107) in the loading position, the carrier element (107) sealing the recess (109) in such a way that between the base body (103) and the carrier element (107) there is a sealed cavity (113) which can be subjected to a vacuum which counteracts the action of the lifting element, and wherein spacers (117a, 117b) are provided which define the clamping position of the carrier element (107) in which the support fl Surface (111) of the carrier element (107) is arranged substantially flush with the top (105) of the base body (103).
    [2]
    2. Holding device (100) according to claim 1, wherein the base body (103) comprises a sealing means (119), in particular a sealing lip, which surrounds the carrier element (107) at a distance and between the top (105) of the base body (103) and can seal the substrate (101).
    [3]
    3. Holding device (100) according to one of the preceding claims, wherein the carrier element (107) is provided with a seal (125) which seals on the side wall of the recess (109) in the base body (103).
    [4]
    4. Holding device (100) according to one of the preceding claims, wherein the carrier element (107) fixing means (123a, 123b) for fixing the on the
    21/28
    - 21 support surface (111) on lying substrate (101), in particular suction openings (201a, 201b, 201c, 201d).
    [5]
    5. Holding device (100) according to claim 4, wherein the cavity (113) and the fixing means (123a, 123b) are fluidly connected.
    [6]
    6. Holding device (100) according to one of the preceding claims, wherein the holding device (100) comprises a pressure connection via which the pressure in the cavity (113) can be controlled.
    [7]
    7. Holding device (100) according to one of the preceding claims, wherein the lifting element comprises a tensioning element (115a, 115b), in particular a compression spring, which is designed to exert a force on the carrier element (107) in order to raise the latter.
    [8]
    8. Holding device (100) according to one of the preceding claims, wherein the holding device (100) comprises a rotating device for rotating the holding device (100), in particular the base body (103) and / or the carrier element (107).
    [9]
    9. Production system (300) for microstructure components, which comprises a holding device (100) according to one of the preceding claims.
    [10]
    10. A method (400) for holding a substrate (101) in a holding device (100) with a base body (103) and a carrier element (107), the method comprising the following method steps:
    Lifting (401) the carrier element (107) into a loading position, the carrier element (107) having a smaller diameter than the substrate (101),
    - placing (403) the substrate (101) on a support surface (111) of the carrier element (107),
    - Fixing (405) the substrate (101) on the support surface (111), and
    - Lowering (407) the carrier element (107) into a clamping position, in which the bearing surface of the carrier element is arranged essentially flush with an upper side of the base body
    22/28
    - 22 - whereby for fixing (405) the substrate (101) on the support surface (111) a first negative pressure is applied to a cavity (113) of the holding device (100), whereby for lowering (407) the carrier element (107) into the A second negative pressure is applied to the cavity (113) in the clamping position, the second negative pressure being a lower pressure than the first negative pressure.
    [11]
    11. The method (400) according to claim 10, wherein the placement (403) of the substrate (101) on the support surface (111) of the carrier element (107) brings about a pressure reduction in the cavity (113), in particular by sealing suction openings on the Support surface (111), the lowering (407) of the carrier element (107) into the clamping position being triggered and / or supported by the pressure reduction.
    [12]
    12. The method (400) according to one of claims 10 and 11, wherein the carrier element (107) presses the substrate (101) in the clamping position against the upper side (105) of the base body (103), one thereby pressing onto the substrate (101) exerted force is so large that any bending of the substrate (101) is reduced.
    [13]
    13. The method (400) according to any one of claims 10 to 12, wherein the substrate (101) in the clamping position by a vacuum acting between the substrate (101) and the top (105) of the base body (103) on the top (105) is attracted.
    [14]
    14. The method (400) according to any one of claims 10 to 13, wherein the method (400) further comprises rotating the substrate (100), in particular after the lowering (407) of the carrier element (107) into the clamping position.
    23/28
    1.5
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    TW202004977A|2020-01-16|
    DE102019111867A1|2019-12-05|
    CN110544664A|2019-12-06|
    JP2019208020A|2019-12-05|
    US11148258B2|2021-10-19|
    US20190366517A1|2019-12-05|
    KR20190135929A|2019-12-09|
    AT521280A3|2021-10-15|
    US20210394340A1|2021-12-23|
    NL2021006B1|2019-12-04|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    NL2021006A|NL2021006B1|2018-05-29|2018-05-29|Holding apparatus and method for holding a substrate|
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